摘要
阐述了自加热效应产生的原因以及它对SOI电路的影响,并介绍了为克服自加热效应和满足某些特殊器件和电路的要求,国内外正在竞相探索研究的新型SOI结构,如SOIM、SilicononAlN、GPSOI、SiCOI、GeSiOI、SON、SSOI等。结合SOI新结构制备工作,报道了SOI的自加热效应及其新结构的研究进展。
A brief introduction of the self -heating effect of SOI material and the t hermal analysis on it are presented.The concept of self-heating and the effects which cause,degradation of the drain current and formation of negative di fferential transconductance are described.Some new structures of SOI have been studied,such as SOIM,s ilicon -on -AlN,GPSOI,SiCOI,GeSiO I,SON,SSOI ,all of which can alleviate the effects ca used by self -heating.
出处
《功能材料与器件学报》
CAS
CSCD
2002年第2期205-210,共6页
Journal of Functional Materials and Devices
基金
国家自然科学基金(No.90101012)
国家重点基础研究项目(No.G20000365)
关键词
自加热效应
沟道电流
跨导畸变
负微分迁移率
SOI
self -heating effect
drain curren t
aberration of transconductance
negative differential mobility
new SOI structure