含微量Al,Sn元素铜合金的腐蚀行为研究

The Corrosion Behavior of Copper Alloys Containing Trace Al and Sn

通过高速旋转腐蚀实验、金相、电化学方法等研究了纯铜中添加微量Al,Sn元素对其耐蚀性能的影响。结果表明 :在纯铜中添加微量Al( 1%～ 2 % ) ,Sn( 0 .5 %～ 2 .5 % )元素可抑制其在室温下动海水中的腐蚀。其中Cu 2 .5Sn 2Al耐蚀性最好 ,腐蚀深度为0 .0 192mm a。实验发现 ,铜合金表面形成了主要由Cu膜、Cu Al

The corrosion resistance of the copper alloys with trace Al,Sn has been studied by means of high-speed rotate corrosion,OM,electrochemical tests. Experimental results show that the addition of Al(1%～2%) or Sn(0.5%～2.5%) to copper alloys inhibited their corrosion in stirred sea water at normal temperature. With increase of the content of Al and Sn,alloys' corrosion resistance were improved and Cu-2.5Sn-2Al had the lowest corrosion rate,which was 0.019 mm/a. A film consisting of Cu, Cu-Al-Mg and Sn compounds was formed. This film resisted the localized corrosion because it was segregated on the surface of Al and Mg compounds. The film also had the inhibitory effect on even corrosion,due to the formation of Sn oxidation compounds. However, the Sn compounds did not inhibit localized corrosion,probably without the synergistic effect between Mg and Sn.