热电制冷过程中散热强度对制冷参数的影响分析

Influence of Intensity of Heat Emission on Performance of Semiconductor Refrigeration

对热电制冷电偶对进行传热分析 ,得到了热电制冷性能与热端散热强度之间的微分方程 .在第三类边界条件下进行求解可得到热电制冷性能与热端散热强度之间的解析关系式 .经过对其进行数值计算和求解 ,得出了散热强度对热电制冷性能影响的曲线 .由此得出 :随着散热强度的不断增强 ,热电制冷的性能逐渐提高 ;当热端散热强度增加到一定值后 ,散热强度的增加对制冷性能的影响就趋于缓慢 ;从经济性考虑 ,热电制冷中存在最佳热端散热强度 ,不可能无限制地通过提高热端散热强度来改变热电制冷器的制冷性能 .所以 ,在实际应用中应合理优化设计和改进热端散热系统 .

Heat transfer analysis for semiconductor refrigeration module was done,and the numerical solution of the third kind boundary condition of this model was provided.Furthermore,the analytic formula of heat absorbed Q c,heat dissipation Q h,input power P and refrigeration coefficient ε were obtained,and the graphs for the relation of heat absorbed Q c,heat dissipation Q h,input power P ,refrigeration coefficient ε and intensity of heat emission α 1 by numerical calculation were made.This paper provided the basis for the optimal design of heat emission system of the hot side of semiconductor refrigeration.