摘要
本文结合了集成电路技术的进步 ,通过对集成电路封装发展的探索 ,找出了其中的关键步骤 ,提出了发展中的内外因素 ,摸索其规律 。
Based on the progress of technology in IC and the development of IC package,the key steps of IC package,as well as the rules of developing are found out by means of consideration of internal and external factors.In adition,a suggestion how to posh the development of IC package in the future is presented.
出处
《微电子技术》
2002年第3期1-5,共5页
Microelectronic Technology
