摘要
在半导体制造中 ,光刻胶是重要的原材料之一。本文从转速与膜厚、感光灵敏度、图形变化差等方面对ORM 85光刻胶进行了研究 ,得出了用于大生产的一套工艺。解决了接触式曝光方式粘版的问题及提高了产能。
Photoresist is one the most important material in wafer Fab.In this paper,OMR85 photoresist will be studied by studying its filmthickness.Sensitivity and linearity ect.It comes up a type of process which can be used in wass productin.A solution is submitted for the fact of attaching to mask when cointact exposure.And the throughput is improved.
出处
《微电子技术》
2002年第3期51-53,共3页
Microelectronic Technology