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硅基衬底Ba_(0.5)Sr_(0.5)TiO_3厚膜制备的Sol-gel新方法 被引量:7

A Modified Sol-Gel Coating Method for BST Thick Films on Silicon Substrates
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摘要 介绍了一种改进的制备压电厚膜的 sol- gel新方法 ,通过添加聚乙烯吡咯烷酮 (poly vinyl pyrrolidone,PVP)来抑制厚膜中裂纹的产生 .文中讨论了最大无裂纹膜厚与 PVP摩尔比及热处理的关系 ,并给出了 BST的 SEM显微照片 . A modified dip-spin method for BST thick films preparation is introduced.In order to avoid crack formation,an organic macromolecule poly vinyl pyrrolidone (PVP),which has the hybrid effect,is dispersed uniformly into a sol-gel solution containing Ba(CH_3COO)_2-Sr(CH_3COO)_2-Ti(OC_3H i_7)_4.The thick films are coated by repetitive spin coatings and then annealed at a proper temperature.The maximum thickness can reach up to 1μm by this modified dip-spin method.The dependence of the thickness on the PVP quantity and Mole density are discussed,and some experimental details as well as the SEM photos of the thick films are given.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2002年第8期830-834,共5页 半导体学报(英文版)
基金 国家 973( No.G19990 3310 5 )资助项目 清华大学 985 ( No.985 -信息 -4 0 -重点 -0 5 )资助项目~~
关键词 硅基衬底 厚膜 MEMS 溶胶-凝胶 微电子机械 压电陶瓷 BST thick film MEMS sol-gel
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参考文献10

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