摘要
热分析、热设计是提高印制板热可靠性的重要措施。基于热设计的基本知识 ,讨论了 PCB设计中散热方式的选择、热设计和热分析的技术措施。
The reliable thermal analysis and design is an important measure to improving the PCB′s reliability Based on the basic knowledge of thermal design,the question of selecting the cooling plan and the specific technical measure of thermal analysis and design are discussed
出处
《现代电子技术》
2002年第8期85-87,共3页
Modern Electronics Technique
