温度对不同厚度导光板翘曲变形的影响

Effect of Temperature on the Warpage and Deformation of Different Thickness Light Guide Plate

以中大尺寸侧入光式LED背光源的应用开发为目的,对3种不同厚度导光板在经裁切和抛光机械加工、印刷网点、高温试验后3种条件下得最大翘曲变形量进行了实验研究。实验温度为60±2℃,湿度为50%±10%RH,实验时间为24 h,实验中所用导光板的样品与量产导光板一致。实验结果表明,导光板越薄其翘曲变形受温度影响越大,但薄型导光板变形后易恢复。

Application development in large size side light type LED backlight source for the purpose, to three kind of different thickness of light guide plate respectively in the light guide plate by cutting and polishing machining, printing dot after high temperature test, three conditions of the maximum warpage were studied. Test temperature of 60 ±2 ℃, humidity is 50% ± 10% RH, test time is 24 hours, the light guide plate samples and mass production of light guide plate, results show that the light guide plate is thin the warping deformation affected by temperature increases, but the light guide plate is easy to recovery after deformation.