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Al_2O_3陶瓷化学镀Ni-P工艺研究 被引量:3

Study of Ni-P Chemical Plating Process on Al_2O_3 Ceramic
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摘要 采用化学镀方法在Al2O3陶瓷表面施镀Ni-P合金镀层,借助SEM、XRD等分析手段对镀层结构进行了表征,研究主盐浓度、还原剂浓度、粗化时间、镀液pH值、稳定剂以及水浴温度对镀层形貌、相组成以及镀层与Al2O3陶瓷基体结合强度的影响规律.结果表明,主盐NiSO4的浓度为25 g/L、NaH2PO2的浓度为30 g/L、pH=5、粗化时间为30 min、水浴温度为92℃时,Ni-P合金镀层与Al2O3陶瓷基体的拉伸载荷最高为49.9 N;显微组织观察发现,Ni-P合金镀层显微组织为胞状结构,胞状物排列紧密,无缝隙和孔洞,具有非晶态特征,镀层断口形貌为镀层从基体与镀层分界面被"揭开"方式断裂. Ni- P alloy plating was plated on the Al2O3 ceramic by way of chemical plating in this article,and the plating structure of materials was characterized with scanning electron microscopy(SEM),X-ray diffraction(XRD) and so on,the influence discipline of the primary salt concentration,reductant concentration,coursing time,the PH value of plating solution,stabilizer and bath temperature on the morphology of plating,phase composition and the bonding strength of plating and Al2O3 ceramic matrix were investigated.Results showed that the tensile load of Ni-P alloy plating and Al2O3 ceramic was maximum that the value was 49.9 N,when the primary salt NiSO4 concentration was 25 g /L,NaH2PO2 concentration was 30 g /L,pH = 5,coursing time was 30min,bath temperature was 92 ℃.Microstructural was observed that Ni-P alloy plating microstructural was cellular structure,the celluar body arranged closely,without the crack and hole,and with the feature of amorphous state,the fracture morphology of the plating shows the fracture mechanisms was that plating were uncovered from the matrix and the interface of plating.
出处 《哈尔滨理工大学学报》 CAS 2014年第3期20-23,共4页 Journal of Harbin University of Science and Technology
关键词 化学镀NI-P 工艺 拉伸强度 显微组织 chemical plating Ni-p process tensile load microstructural
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