电子器件用液冷冷板的竖向流道优化设计

Optimization of the channel in the vertical cold plate for cooling electronic devices

设计了用于电子器件散热的竖向冷板。采用ANSYS软件模拟的方式,对不同结构的冷板流场、压力场、温度场进行了分析,梳理了设计中遇到的问题及解决的方式,得出设计中侧重点的不同导致的结果差异,这也为以后的工程实践提供一定的参考。

This paper designed a vertical cold plate for heat transfer of the electronic elements. The ANSYS software was used to analyze the flow dynamics, pressure and temperature of the cold plate, hackled the problem in the design and the solved manner. Owing tothe emphasis particularly on the difference, the result is different. It also will provide a reference for the project practice.