Ni-5%W合金基带的电化学抛光

Electro-polishing of Ni-5%W Substrate for Coated Conductor

为改善Ni-5%W合金基带表面质量,以磷酸-硫酸和添加剂为电解液,采用均匀实验设计方法进行电解抛光,利用原子力显微镜对样品表面形貌进行表征,并用DPS(Data Process System)软件对抛光结果进行逐步回归优化。结果表明,在室温下,采用磷酸(85%)、硫酸(98%)和有机添加剂,以体积比为4∶3∶3的抛光液抛光效果较好,抛光后基带表面均方根粗糙度在25μm×25μm范围内可降低到5nm以下。

For improving surface quality of Ni-5% W substrate ,the substrate was electro-polished in phosphoric acid-sulfuric acid and organic additives system with uniform design. Surface topography of the substrate was characterized by AFM, and the electro-polishing technique was optimized by DPS （Data Processing System） software. Results indicated that,when volume ratio of H3PO4, H2SO4 and organic additives was 4： 3：3 ,polishing effect was good and the root mean square roughness of polished substrate surface could be reduced to 5nm or less within the range of 25μm×25μm.