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复材/复材二次胶接胶接质量及强度影响因素研究 被引量:12

Study on Factors on the Co-bonding Quality and Bonding Strength of Composite Panels
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摘要 通过不同尺寸的高温结构胶-双马基碳纤维层压板的二次胶接试验,对二次胶接过程中影响胶接内部质量和胶接强度的因素进行了分析。结果表明,在胶接反应过程中,复材板与复材板之间的实际配合间隙大于复材板制造的叠合公差,准确测量配合间隙及适当进行胶膜补充是提高胶接质量的重要保障,通过模拟胶接过程来测量配合间隙可行。对大尺寸胶接界面,通过提高胶膜的流动性能够提高胶接质量,但却降低了胶接强度。胶接强度随胶膜厚度增加而增加,但达到极值后随胶层厚度的增加而减小。 The factors in co-bonding process that influence the co-bonding quality and bonding strength were analyzed by co-bonding experiments between bismaleimide laminates of different size.It showed that the actual gaps between two laminates in the curing process were larger than the maximum sum of laminates tolerance.In a word,to measure the fitting gaps and make compensation to that were the key points for improve the bonding quality and it was a good way to measure the fitting gap by simulating the co-bonding process.Increasing the liquidity of adhesive film can improve the bonding quality,which decreased the bonding strength at the same time.The bonding strength increased with the increasing of film thickness,which decreased after reaching the peak value.
出处 《塑料工业》 CAS CSCD 北大核心 2014年第7期77-80,共4页 China Plastics Industry
关键词 二次胶接 胶接强度 胶接分层 胶层厚度 流动性 Co-Bonding Bonding Strength Bonding Split Adhesive Thickness Liquidity
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  • 1曲春艳,王德志,冯浩.J-188双马来酰亚胺基复合材料胶接用结构胶膜[J].材料工程,2007,35(z1):15-19. 被引量:13
  • 2吴代华,晏石林.有拉-弯耦合效应时复合材料接头的胶层应力分析[J].武汉工业大学学报,1989,11(2):233-241. 被引量:5
  • 3万建平,邹国发,龙国荣.表面改性剂改进结构件界面粘接性能研究[J].粘接,2006,27(4):49-50. 被引量:3
  • 4邹贤武,乔海涛,齐楠.SY-D15表面处理剂的性能研究[J].粘接,2007,28(2):10-12. 被引量:7
  • 5矫桂琼 杨宝宁.层间软化复合材料层压板的孔边应力分析.第十一届全国复合材料学术会议论文集[M].合肥,2000.838-842.
  • 6Wang C, Niu Y A. Influences of surface treatment on humidity aging properties of adhesive/carbon-carbon composite joints. In:Preprints 2007 Beijing international bonding technology symposium & 2^nd asian conference on adhesion, Poster Session, 2007:40.
  • 7Tillman M S, Hayes B S, Seferis J C. Influence of substrate-adhesive resin compatibility on the fracture of composite bonds. In :46^th International SAMPE symposium,2001:8 -19.
  • 8Chabot K A, Bonk R B. Evaluation of adhesives and primers systems for adhering carbon/epoxy composites and metals. In:25^th international SAMPE technical conference, 1993:338 - 352.
  • 9北京粘接学会编译.胶粘剂技术与应用手册[M].北京:宇航出版社,1991..
  • 10叶天麒,周天孝.航空结构有限元分析指南[M]航空工业出版社,1996.

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