摘要
提出了一种支持EoS(Ethernet over SDH)的SDH通道交叉芯片设计方案。遵循ITU-T G.707、ITU-TG.704、ITU-TG.741和ITU-TG.742等相关建议,该方案能够实现以太网数据经过PPP/HDLC、LAPS和GFP封装后的数据包,这些数据包经过SDH STM-64帧实现64个VC4高阶通道数字交叉和84个VC-11/12/2/3低阶通道数字交叉,通过级联方式可实现40G和160G的交叉容量。
A scheme for SDH channel cross-connect chip with supporting EoS (Ethemet over SDH) was presented. According to the suggestion of ITU-TG.707, ITU-TG.704, ITU-TG.741, ITU-TG.742 and so on, the data of Ethemet with the package of PPP/HDLC, LAPS and GFP can be cross-connected for transmission among 64 VC4 for high-path or 84 VC-11/12/2/3 for low-path. It also can realize the function of crossing capacity of 40G and 160G by the means of cascade.
出处
《光通信技术》
CSCD
北大核心
2014年第7期20-22,共3页
Optical Communication Technology
基金
江苏省自然科学基金(BK20130418)资助
江苏高校自然科学研究项目(13KJB470001)资助
淮安市科技支撑项目(SN13047)资助