激光板材下料利用率控制与分析

Control and Analysis of Material Utilization Ratio of Laser Plates

组织开展激光板材切割套裁监控活动,对激光板材切割过程进行分析,通过对激光切割机板材套裁技术进行研究,找出了影响原材料利用率的主要因素,对不同材料、不同板厚以及不同形状的零件进行了优化排版。通过采取措施,最大限度地提高了原材料利用率,达到了成本控制的目的。

Initialized cutting monitor activity of laser plates, through analysis to cutting process of laser plates, re searched clipping technology of laser cutter plates sheath, found out the main factors of affecting using ratio of raw materi als, did optimization composing of parts of different materials, different plates thickness, and different shape. Through tak ing measures, maximized the using ratio of raw materials, realized the goals of controlling costs.