几种常温固化剂体系对有机硅改性环氧树脂涂料性能的影响

Influence of room temperature curing agents on coating performance of organic silicone modified epoxy resins

以自制有机硅改性环氧树脂为基体,石墨、二硫化钼、三氧化二锑为填料,采用5种不同的常温固化剂体系进行固化,探讨其对涂料性能的影响。结果表明引发剂DMP-30/聚酰胺650固化体系涂料的耐热性能最佳,经过320℃和450℃的高温灼烧,质量损失率及硬度、附着力的变化最小。引发剂DMP-30/聚酰胺650、酚醛改性胺固化剂的耐酸碱盐、耐燃油性能相对较优。根据涂料固化动力学的分析结果,DMP-30/聚酰胺650固化体系表观活化能最低,为66.165kJ/mol,反应速率方程为K=8.606×106exp(7958.3/T)(1-α)0.871,体系在低温区的反应速率较快,综合各项性能测试结果,DMP-30/聚酰胺650最适合用作有机硅改性环氧树脂涂料的低温固化剂。

The epoxy resins coatings were prepared based on organic silicone modified epoxy resins,graphite,molyb denum disulfide and antimony trioxide. The coating performances were studied using five different kinds of room tempera ture curing agents. The results showed that initiator DMP 30/polyarnide 650 curing system achieved best heat resistance, which manifested by the fact that mass loss rate,hardness and adhesion changed least after 320 ℃ and 450℃ heat tests. Fuel resistance, acid, alkali and salt resistance of DMP-30/polyamide 650 and phenolic modified amine curing agents systems were relatively better than other curing agents. According to the coating curing kinetics analysis results,the apparent activa- tion energy of initiator DMP-30/polyamide 650 curing system was the lowest of 66. 165 KJ/mol,and reaction rate equation was K=8.606×10^6exp（7958.3/T）（1-α）^0.871 , which implied that the reaction rate was fast even at low temperature. DMP- 30/polyamide 650 was the most suitable room temperature curing agent for organic silicone modified epoxy resins coating regarding the comprehensive performances.