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On the formation of the interlayer between Ni-P coating and AZ33magnesium alloy substrate by means of in situ SEM observation

On the formation of the interlayer between Ni-P coating and AZ33magnesium alloy substrate by means of in situ SEM observation
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摘要 Pre-treatment process is the key step for electroless plating. Once a suitable pre-treatment film is in place, the desired metals can be plated. In this paper, Ni-P coating was successfully prepared on AZ33 magnesium alloy with Mg(OH)2 pre-treatment film by electroless plating. To investigate the role of MgF2 in Ni-P coating, the deposition procedures between Mg(OH)2 pre-treatment film and Mg(OH)2-MgF2 pre-treatment film (a traditional process) were compared. The surface morphology variations of coatings were observed with scanning electron microscopy and the compositions were analyzed by energy dispersive spectrometry. The results showed that during the plating, both MgF2 and Ni-P deposited at the initial stage, and MgF2 distributed in the bottom of the coating, forming a transitional interlayer with Ni- P. According to the heat quench test, a poor adhesion of the coating mainly occurred between the MgF2 and Ni-P coating. Pre-treatment process is the key step for electroless plating. Once a suitable pre-treatment film is in place, the desired metals can be plated. In this paper, Ni-P coating was successfully prepared on AZ33 magnesium alloy with Mg(OH)2 pre-treatment film by electroless plating. To investigate the role of MgF2 in Ni-P coating, the deposition procedures between Mg(OH)2 pre-treatment film and Mg(OH)2-MgF2 pre-treatment film (a traditional process) were compared. The surface morphology variations of coatings were observed with scanning electron microscopy and the compositions were analyzed by energy dispersive spectrometry. The results showed that during the plating, both MgF2 and Ni-P deposited at the initial stage, and MgF2 distributed in the bottom of the coating, forming a transitional interlayer with Ni- P. According to the heat quench test, a poor adhesion of the coating mainly occurred between the MgF2 and Ni-P coating.
出处 《Chinese Chemical Letters》 SCIE CAS CSCD 2014年第6期947-952,共6页 中国化学快报(英文版)
基金 the financial support of NSFC (No.51375379),Key State Lab.Foundation of China
关键词 Electroless plating Magnesium alloys Ni-P coating INTERLAYER Deposition procedure Electroless plating Magnesium alloys Ni-P coating Interlayer Deposition procedure
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