摘要
随着武器系统高可靠性要求的不断加强和国产电子元器件基础水平的不断提高,越来越多的陶瓷封装军用SMD开始应用于型号产品。该类器件的引线多采用镀金工艺,焊接时必须进行除金处理。用四种焊接工艺方法对镀金引脚器件焊接,对比分析器件焊点的焊接质量,得出镀金引脚器件最佳焊接工艺方法。
With high reliability requirements of weapon system and improvement of the basis level of domestic electron components, more and more ceramic packaging of SMD apply to the military product. The component lead is mostly plated with gold, but the gold coating must be removed when the component is to be soldered. Compare and analyze the soldering quality of solder joints of golding-plated lead SMT components using four soldering methods, get the best soldering method for golding-plated lead components.
出处
《电子工艺技术》
2014年第4期218-221,248,共5页
Electronics Process Technology
基金
国防科技工业技术基础科研项目(项目编号:Z042010B002)
关键词
镀金
引脚
焊点
质量分析
Golding-plated
Lead
Soldering joint
Quality analysis
