摘要
主要研究了存储周期对锡铅/纯锡两种镀层的塑封IC器件引脚焊接性能的影响。分别针对两种不同镀层的元器件引脚设计储存老化试验,通过可焊性及数据分析等手段,获得存储对镀层老化程度的影响及可焊性的变化情况,从而为制定合理的元器件储存期限提供试验依据。
Effect of storage period on solderability of pins on plastic package IC component was studied. Designed aging storage for two kinds of plating on component’ pins. Then experimented and analyzed the test data, obtained the change of the solderability and the plating aging degree with the storage. Consequently, provided the criterion for establish the logical storage term of components.
出处
《电子工艺技术》
2014年第4期227-229,241,共4页
Electronics Process Technology
