摘要
CQFP器件由于其卓越的高可靠性能,在军事、航空、航天领域都有着广泛的应用,但是由于该类器件自身的特点,在实际组装过程中容易出现偏离焊盘、引脚变形以及焊点开裂等问题,这些都是装配工艺必须要尽量解决和避免的问题。阐述了CQFP器件的特点,分析了影响CQFP器件组装可靠性的主要工艺环节,给出了组装的注意事项和一些具体实施方法。另外列举了CQFP器件的一些常见缺陷,对发生的原因进行了分析,并结合实际给出了有效的解决措施。
CQFP with high reliability has a wide range of applications in the field of military, aviation, aerospace, but it is prone to deviation from the bonding pad, the pin deformation and cracking of solder joints in the actual assembly. These are the problems that must be solved and prevented. Expound the characteristics of CQFP, analyze the main processes that influence assembly reliability of CQFP, give out the matters needing attention and some concrete implementation method of assembly. Also enumerate some of the common defects of CQFP assembly, analyze the reasons, and give out effective solutions.
出处
《电子工艺技术》
2014年第4期230-233,共4页
Electronics Process Technology
关键词
CQFP
引线成形
粘固
引脚共面性
返修
Ceramic Quad Flat Pack
Lead forming
Sticking
Lead coplanarity
Reworking
