Cu-SiC纳米复合材料的制备及其组织性能研究

A Study of Preparation and Structure Properties of Cu-SiC Nano Composite

采用电沉积工艺实现纳米SiC微粒与基质金属铜离子共沉积,制备出Cu-SiC纳米复合材料。观察了复合材料的形貌组织,测定了复合材料的显微硬度,并分别与纯铜材料的作比较。结果表明:相比于纯铜材料,Cu-SiC纳米复合材料的表面较平整,组织较匀致,且显微硬度有所提高;但纳米SiC微粒的添加量对复合材料的形貌组织和显微硬度均有较明显的影响,在SiC 15g/L的条件下制备的复合材料形貌最为平整,组织最为紧致,显微硬度最高。

The Cu-SiC nano composite was prepared by electrolytic codeposition of nano SiC particles and metal matrix copper ions.The morphology and microstructure of the composite were observed,the microhardness of the composite measured,and also compared with that of pure copper material respectively.The results show that compared with pure copper material,Cu-SiC nano composite presents a smoother surface,compacter texture and higher microhardness; however,nano SiC particle addition amount has an obvious influence on both the microstructure and microhardness of the composite.The composite prepared with 15 g/L of nano SiC particles features the smoothest morphology,tightest texture and highest microhardness.