摘要
随着陶瓷球栅阵列(CBGA)封装形式的产品被广泛应用,空洞对可靠性的影响受到重视。以CBGA256封装形式的电路产品为例,通过调节回流温度曲线研究空洞形成的机理和回流焊时间对空洞率的影响。研究结果表明,随着加热时间的增加,焊点空洞的数量呈现先降低后升高的趋势,而加热时间过长不利于助焊剂残留的排出造成空洞增多,而回流时间的增加有利于回流过程中熔化焊料内部空洞的溢出。
With the widely used of ceramic ball grid array packaging products,the influence of void on the reliability of CBGA is a focus of concern.The paper took CBGA256 circuit products for examples,to study the formation mechanism of void and the influence of reflow time on void ratio by adjusting reflow temperature profile.The results show that the voids increased firstly and decreased subsequently with the heat time increasing,but voids increased significantly because of the flux residue if the heat time was too long.On the other hand,the exhaust of void in solder joint was promoted by increasing reflow time.
出处
《电子与封装》
2014年第7期9-11,22,共4页
Electronics & Packaging
关键词
陶瓷外壳
CBGA植球
回流曲线
空洞
ceramic substrate
CBGA ball placement
reflow profile
void
