摘要
集成电路作为新一代信息战略产业的基础,工艺、封装、应用的发展对测试提出了诸多挑战,同时测试作为集成电路产业链的一环,与设计、制造、封装等环节紧密相联。阐述了集成电路设计中高速、高集成度及测试成本对测试的挑战以及相应的测试解决方案,同时对测试与设计、封装、应用等产业链环节联接的典型技术如测试仿真到测试向量转换、inkless map、测试自动化数据等进行了描述。
As the basis of a new generation of strategic industry information,the development of integrated circuits process,package,and application presents many challenges to test.While test is an important link of IC industry chain,it is closely linked with design,manufacture,packaging and other sectors.The paper describes the test challenges and the corresponding test solutions for the integrated circuit with the design technologies such as high speed,high integration.Meanwhile,the typical technical for linking the industrial chain e.g.testing and design,packaging,and other industrial applications are described,including test simulation,test pattern conversion,inkless map,test automation data.
出处
《电子与封装》
2014年第7期16-18,28,共4页
Electronics & Packaging
关键词
高速接口测试
高集成度
测试经济性
测试向量压缩
high speed interface test
high level of integration
cost reduction techniques
pattern compression
