摘要
综述了近年来国内外微电子领域用聚酰亚胺涂层胶的研究进展情况,对非光敏型与光敏型聚酰亚胺涂层胶的化学合成方法及其结构与性能进行了分析和总结,并提出了其今后的发展方向。
The recent development of polyimide coating adhesive for microelectronics at home and abroadwas reviewed. The synthetic methods and the relationship between structure and properties of non-photosensitive and photo sensitive polyimide coating adhesive were analyzed and summarized, and the futuredevelopment direction was proposed.
出处
《绝缘材料》
CAS
北大核心
2014年第2期8-13,18,共7页
Insulating Materials
关键词
微电子
聚酰亚胺
涂层胶
microelectronics
polyimide
coating adhesive
