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平板手机后盖注塑成型CAE模拟与正交优化 被引量:5

Injection Molding CAE Simulation and Orthogonal Optimization of Ph-ablet Back Cover
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摘要 以平板手机后盖为例,基于CAE软件Moldflow对该手机后盖塑件浇口数量与位置、充填和冷却进行分析;为减小塑件的翘曲变形,采用正交试验方法进行成型工艺参数模拟;通过极差与方差法对试验数据进行分析,得到了四个工艺参数对翘曲变形的影响程度及最佳组合工艺条件。结果表明:CAE的应用可以改善塑件的翘曲变形,得到模具合理的结构设计方案,缩短模具开发周期,提高企业核心竞争力。 Based on Ph-ablet back cover as an example, the CAE software of Moldflow was used to finish the analysis of gate number and location, filling and cooling system. In order to reduce the warpage, orthogonal test method was used through the process. Through the analysis of experimental data with range and variance method, the significant of the four conditions warpage effects and the best combination of process parameters was obtained. The results indicate that the application of CAE can improve the warpage of part and obtain reasonable structure design of the mold. Finally, the development cycle shortens and core competitiveness of the enterprise improves effectively.
出处 《塑料科技》 CAS 北大核心 2014年第8期99-102,共4页 Plastics Science and Technology
关键词 注塑成型 模流分析 正交试验 翘曲变形 Injection molding Mold flow analysis Orthogonal test Warpage
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