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集束型半导体装备的性能分析模型研究 被引量:1

Research on performance analysis model of cluster tools
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摘要 由于集束型装备自身结构的复杂多变,使得对集束型装备的性能分析和产能预测变得非常困难。建立集束型装备性能分析模型是预测装备产能和辅助装备设计的有效方式之一。以可扩展的模块化方式,建立了装备的随机Petri网模型,模型中引入随机变迁来描述装备活动时间的随机性;基于该模型,采用马尔可夫链分析方法,研究了装备主要性能参数如吞吐量、晶圆滞留率和利用率的理论模型。研究结果为集束型半导体装备的性能分析提供了一种有效手段。 The complexity and uncertainty of cluster tools make the performance analysis and prediction of the cluster tools be -coming a very complex task .Establishing cluster tools performance model is an effective way to predict the performance of produc -tion equipment and assisting equipment design .Firstly,the stochastic Petri nets model is developed with stochastic transition re-presenting the activity time variation ,the model is based on modular and easy to extend .Then,based on the model ,some perform-ance models are deduced using the Markov process method ,such as the throughput model and the wafer residency rate in process chamber model .The research can assist cluster tools performance analysis .
出处 《现代制造工程》 CSCD 北大核心 2014年第8期19-25,共7页 Modern Manufacturing Engineering
基金 国家自然科学基金项目(61104093)
关键词 随机PETRI网 集束型 半导体 马尔可夫链 性能 模型 Stochastic Petri Nets (SPN) cluster tools semiconductor Markov process performance model
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