摘要
应用失效物理方法的故障预测与寿命评价方法已经得到了越来越广泛的应用,该文主要介绍了基于失效物理方法的焊点疲劳寿命评价流程设计。首先给出了单板焊点疲劳寿命评价的完整流程,以及各失效物理模型的应用阶段,并且对所应用的失效物理模型详细说明了其适用条件,以及其应用时的输入输出参数。为单板焊点疲劳寿命评价和可靠性设计及评价提供参考。
The failure prediction and life assessment method based on PoF approach has been more widely used.This paper mainly describes the fatigue life assessment process design of board level solder joints based on PoF approach.At first the complete board level solder joints fatigue life evaluation process is given, and the application of PoF model in various stages of the evaluation process is stated.Then a detailed description of their applicable conditions,as well as input and output parameters when their application are given,thus providing a reference for the fatigue life evaluation and reliability design and evaluation of board level solder joints.
出处
《电子质量》
2014年第8期23-27,共5页
Electronics Quality
