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花岗石锯切过程中的锯切力特征 被引量:15

Characteristics of the Cutting Forces when Sawing Granite
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摘要 本文通过测量和分析锯切花岗石过程中锯切力以及锯切功率,对锯片所受的单位宽度法向力F'n和切向力F't以及单颗金刚石磨粒所平均承受的法向力和切向力进行了研究。实验过程中在保持金刚石节块表面状态基本不变的情况下,对锯切深度ap、叫进给速度Vf和锯片圆周线速度Vs进行了较大范围的变化。另外还对锯片磨损过程中锯切力的变化进行了跟踪测量。 In this paper, measurement and analysis of the cutting forces and power during circular sawing of gra nite were made to investigate the specific normal force components ( Fn') and tangential force components ( F,') acted on the segmented diamond sawblade and the mean normal and tangential force components (fn and ft) acted on single active diamond grain. The process parameters, including depth of cut (ap), feed rate (vf) and circular linear speed of the sawblade (v, ) , varied over a relatively wide range during the experiments, while the segment surface being kept at a relatively stable state. In addition, the variations of the cutting forces were tracked during the wear process of the sawblade.
出处 《金刚石与磨料磨具工程》 CAS 2002年第4期15-19,共5页 Diamond & Abrasives Engineering
基金 国家自然科学基金资助项目(50175030)
关键词 花岗石 金刚石圆盘锯 锯切 锯切力 granite circular diamond sawblade sawing cutting forces characteristic
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参考文献6

  • 1[1]W.Ertingshausen. Wear process in sawing hard stone. Industrial Diamond Review,1985,5:254~258.
  • 2[2]J.Asche, Deep grinding-a new dimension in cutting granite, Industrial Diamond Review, 1999,59(2):110~122.
  • 3[3]C.Guo et al. Matching forces and power in creep-feed grinding. Proceedings of the 5th International Grinding Conference, SME paper MR93-6.
  • 4[4]S.Malkin. Grinding Technology: Theory and Application of Machining with Abrasives. New York:John Wiley & Sons,1989.
  • 5[5]T.W.Hwang, C.J.Evans, E.P.Whitenton and S.Malkin. High speed grinding of silicon nitride with electroplated diamond wheels, part 1:wear and wheel life. Transaction of the ASME:Journal of Manufacturing Science and Engineering, 2000,122(1):32~41.
  • 6[6]X.P.Xu, Y.Li and S.Malkin. Forces and Energy in Circular Sawing and Grinding of Granite. Transactions of the ASME:Journal of Manufacturing Science and Engineering, 2001, 123(1):13~22.

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