如何应对高密度互连(HDI)板给PCB外观检查带来的挑战

How to Deal with the Visual Inspection Challenge from High Density Interconnect PCB

本文主要阐述了在高密度互连HDI板被广泛应用的新形势条件下给PCB最终外观检查带来的种种挑战及应对方法,希望能给PCB的外观质量检查能力提升提供一些参考建议。

With the HDI board are widely used, it is also brought many new challenges for PCB final visual inspection, so how to deal with these challenges has become an pressing problem for PCB manufacturers. In this paper, some methods are suggested to improve the PCB final visual inspection capabilities.