摘要
本文主要阐述了在高密度互连HDI板被广泛应用的新形势条件下给PCB最终外观检查带来的种种挑战及应对方法,希望能给PCB的外观质量检查能力提升提供一些参考建议。
With the HDI board are widely used, it is also brought many new challenges for PCB final visual inspection, so how to deal with these challenges has become an pressing problem for PCB manufacturers. In this paper, some methods are suggested to improve the PCB final visual inspection capabilities.
出处
《电子科学技术》
2014年第1期13-20,共8页
Electronic Science & Technology