摘要
本文介绍了近年来正在逐年扩大的全球无卤刚性覆铜板的市场,无卤刚性覆铜板向高导热的、低传输损失的、无卤无磷阻燃的、无卤封装基板材料四大板材领域发展。分析了松下电工无卤导热覆铜板R-15T1和日立化成无卤高频/高速覆铜板MCL-LW-900G的性能特点。
In the paper, development of market about worldwide halogen-free rigid copper clad laminate was introduced. Halogen-free rigid copper clad laminate is developing to high thermal conductive, low transmission loss, halogen free and phosphorus free flame retardant,halogen free IC packaging substrate. At the same time, character of R-15T1（PEW） and MCL-LW-900G（Hitachi chemical） was analyzed.
出处
《电子科学技术》
2014年第1期117-128,共12页
Electronic Science & Technology
关键词
刚性覆铜板
印制线路板
市场
无卤
导热
低传输损失
无卤无磷阻燃
无卤封装基板
预测
发展
Rigid copper clad laminate
Printed circuit board
Market
halogen free
Thermal conductive
Low transmission loss
Halogen free and phosphorus free flame retardant
Halogen free IC packaging substrate
Predict
Development
