含羟基聚酰亚胺薄膜的制备

Preparation of polyimide film containing hydroxyl group

以2,2-双[4-(3,4-二羧基苯氧基)苯基]丙二酐(BPADA)、羟基二胺、含氰基二胺(CNDA)为原料,在160℃且不添加化学脱水剂的情况下,制备了含羟基聚酰亚胺(CN-OH-PI)薄膜,并通过傅里叶变换红外光谱、核磁共振氢谱、差示扫描量热法和热重分析等手段研究了其结构和性能。结果表明:成功合成了CN-OH-PI,将其与以BPADA和CNDA为原料制备的含氰基聚酰亚胺(CN-PI)对比,在300℃条件下热处理12.0 h后,CN-OH-PI的玻璃化转变温度比CN-PI提高约20℃。

Hydroxyl-containing polyimide（CN-OH-PI） film was prepared by a new polymerization method with 2,2-bis[4-（3,4-dicarboxyphenoxy）phenyl] malonic anhydride （BPADA） and hydroxy-containing diamine, phthalonitrile-containing diamine （CNDA） as raw materials at 160 ℃ without adding chemical dehydrating agent. The structure and performance of the resultant polyimide were studied by Fourier transform infrared spectroscopy（FTIR）,hydrogen nuclear magnetic resonance（1H-NMR）,differential scanning calorimetry（DSC） and thermogravimetry（TG）. The results indicate that CN-OH-PI is successfully prepared. Compared with the phthalonitrile-containing diamine polyimide films （CN-PI） prepared from BPADA and CNDA, the glass transition temperature of CN-OH-PI is about 20 ℃ higher than that of CN-PI after being heat-treated for 12 hours at 300 ℃.