航天微系统技术综述

A Survey of Space Micro-system

航天微系统技术包括专用集成电路(ASIC)、片上系统(SoC)、单片微波集成电路(MMIC)、混合集成电路(HIC)等微电子技术和微机电系统(MEMS)。文章介绍了这几种技术的特点、发展现状,以及在航天中的应用情况和应用前景。ASIC与SoC技术可显著提高电子系统的集成度和性能,已在航天中得到广泛应用。MMIC技术可用于航天器通信载荷和平台的射频通信部件,已在欧美航天器中大量应用,目前正朝高频段发展。HIC主要包括厚膜HIC和薄膜HIC,特别适于功率器件和微波器件的集成,目前国外已有大量产品用于航天,如"国际空间站"(ISS)。MEMS技术可用于航天器导航、热控、推进、光学遥感与通信等系统,甚至可对航天器设计方法产生重要影响,但目前还处于起步阶段。在以上技术领域,我国虽已开展了一些研究,但与国外相比还存在较大差距。文章针对航天微系统技术的产业布局、发展方式等提出了建议,可为我国的发展规划和战略决策提供参考。

Space micro-system technology includes such microelectronics technologies as ASIC, SoC, MMIC and HIC,and MEMS micro-system. In this paper, the technical characteristics, development status and application prospect of space micro-system technology are introduced. ASIC and SoC technologies are more mature than other micro-system technologies. The wide applications of ASIC and SoC in space technology fields can improve the integration and performance of electronic system remarkably. MMIC technology can be used in communications payloads and RF components of spacecraft, and European and American spacecraft have been equipped with lots of MMIC products. HIC includes MCM-C （multi chip module-ceramic） and MCM-D （multi chip module-deposited thin film）. HIC technology is especially suitable for power devices and microwave devices integration. Currently, there are a large number of HIC products being applied in space, such as ISS. MEMS technology can be used in navigation, thermal control, propulsion, optical remote sensing and communications systems of spacecraft, and even can change the design method of spacecraft. Now, the MEMS technology is only in primary stage. In the above techni- cal fields, some researches have been carried out in China, yet there is still a gap between China and other advanced countries in micro-system technology. For micro-system technology industriallayout and development mode, some suggestions are proposed, which can provide a reference for the development plan and strategic decision in China.