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PECVD制程中C_3F_8替代C_2F_6的研究

Study of Using C_3F_8 to Replace C_2F_6 in PECVD Process
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摘要 研究表明含氟气体的性质决定了原子氟(F)的转化效率,通常在CxFy气体中x的值越大,氟(F)的转化效率也就会越高。所以C3F8(八氟丙烷)比C2F6(乙氟烷)具有更高的利用效率,更少的PFC(全氟化物)的排放。文章主要研究在以四乙氧基硅烷(TOES)为基础的离子增强化学气相沉积(Plasma Enhanced Chemical Vapor Deposition,PECVD)的清洗制程中,利用分解效率高的C3F8气体取代C2F6气体。通过实验设计(Design Of Experiment,DOE),调整腔体压力、射频(RF)功率、气体流量等参数,最终得到最优化的新清洗配方。应用到实际的量产中,有效地降低了成本,减少了PFC的排放。 Research shows that properties of fluorine-containing gas determines the conversion efficiency of atomic fluorine (F) . Usually in the CxFy gas, the larger values of x, the higher conversion efficiency of fluoride (F) . So C3F8 (eight fluorine propane) has higher utilization efficiency and less PFC emissions than C2F6 (B halothane) . This paper mainly studies, in the TOES based PECVD (plasma enhanced chemical vapor deposition) clean process, using C3F8 having high decomposition efficiency to replace C2F6. By DOE (Design of Experiment) , adjust chamber pressure, RF power, gas flow rate and other parameters. Finally get the optimization clean recipe and applied to mass production. Effectively reduce the cost and the emission of PFC.
作者 吴建荣 李刚
出处 《电子与封装》 2014年第1期38-40,共3页 Electronics & Packaging
关键词 C2F6 C3F8 全氟化物 C2F6 C3Fs PFC
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参考文献2

  • 1T Nishikawa. Process comparisons during C3F8 and C2F6 CVD chamber cleaning at ASM Japan[No. AJ18-0064][R].1999.25.
  • 2Avala K. Reduced PFC emissions and gas consumption using a c-C4F8-based PECVD chamber clean chemistry[J].Semiconductor manufacturing,2004.

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