摘要
针对弹载微波多芯片组件功率芯片焊接需求,基于真空共晶工艺,采用正交试验设计,研究了温度曲线、焊片大小、焊接压力三因素对功率芯片焊接过程的影响,并对焊接试样进行了剪切力、空洞率和外观检测。研究得出了各影响因素主次顺序和最优组合,并对优化的焊接参数进行了重复性验证。研究结果对功率芯片的真空共晶过程有一定指导意义。
The vacuum eutectic welding technology of micro-wave GaAs power chip was studied in this paper. The process parameters such as temperature curve, solder size, and welding pressure were experimented by orthogonal experimental method. The shear strength, complete penetration and appearance of the experiment pieces were evaluated. The results indicate that all paramaters affect the welding of micro-wave GaAs power chip significantly, and the experiment pieces that welded by the optimized parameters could meet the GJB548B demands.
出处
《航天制造技术》
2014年第4期15-18,27,共5页
Aerospace Manufacturing Technology
