甲基磺酸盐快速镀镍工艺参数对镀层内应力的影响

Effect of Electroplating Parameters on Internal Stress of Nickel Coatings Deposited from Methyl Sulphonate Bath

为了探索出能在较低温度、较宽温度范围内适合工业化生产的快速电镀镍工艺,以甲基磺酸盐溶液为基础,研究了添加剂种类、用量、施镀条件等对镀层内应力、形貌等影响的规律。结果表明:添加剂和施镀条件对镀层内应力和形貌有较大的影响,当添加剂糖精钠、1,4-丁炔二醇、对甲苯磺酰胺、十二烷基硫酸钠用量分别为2.00,0.40,0.50,0.05 g/L,镀液温度50℃,p H值3~4,电流密度10 A/dm2时,镀层内应力最小、质量最优;与传统的镀镍方法相比,本工艺具有高效、节能等突出特点。

The Methyl sulphonate was used as the major ingredient to formulate the plating bath,and the effects of the electroplating parameters(including the type and dosage of additives as well as the electroplating condition) on the internal stress as well as morphology of as-prepared Ni coatings were investigated.Results showed that the additives and plating conditions had great impacts on the internal stress and microstructure of Ni coatings,Particularly,when the dosages of additives sodium saccharin,1,4-butynediol,p-toluene sulphonamide!and sodium dodecyl sulfate were fixed at 200,0.40,0.50,0.05 g/L,respectively,while the electroplating conditions were selected as temperature of 50 ℃pH value of 3 ~4,and current density of 10 A/dm^2,resultant Ni coating exhibited the minimum internal stress as well as the best quality.As compared with traditional Ni electrodeposition techniques,the present approach was characterized by a high efficiency and a low energyconsumption.