摘要
提出了一种基于集成温度传感器的硅微陀螺仪数字化温度补偿方法。首先,介绍了集成温度传感器的硅微陀螺仪基本结构原理,分析了硅微陀螺仪动力学方程以及温度变化对硅微陀螺仪谐振频率、品质因数、标度因数和零偏的影响。然后,设计了基于FPGA的硅微陀螺仪数字化补偿电路。最后,经过温度特性实验得到标度因数和零偏随温度变化曲线,建立了温度补偿模型,提出分段温度补偿方法。经过温度补偿后,标度因数和零偏的温度系数分别由316.66×10-6/℃和366.22°/(h·℃)减小为69.67×10-6/℃和115.25°/(h·℃),证明了补偿方法的正确性和可行性。
A digital temperature compensation method was proposed based on integrated temperature sensor for the silicon micro gyroscope. First,the structure of the gyroscope with integrated temperature sensor was discussed. And the dynamics equations and effect of temperature variation to the resonant frequency,quality factor,scale factor and zero bias for the silicon micro gyroscope was analyzed. Then,the digital circuit was designed based on the FPGA. Finally, the relation between scale factor and temperature was acquired by the experiments of temperature characteristics,the compensation model was established and the temperature compensation is implemented. Through the compensation method proposed, the temperature coefficients of the scale factor and zero bias decrease from 316. 66×10^-6/℃ and 366. 22°/(h·℃)to 69. 67×10^-6/℃ and 115. 25 °/(h·℃)respectively. The results exposed that the method is correct and feasible.
出处
《传感技术学报》
CAS
CSCD
北大核心
2014年第6期770-774,共5页
Chinese Journal of Sensors and Actuators
基金
国家自然科学基金项目(61104217
U1230114)
关键词
硅微陀螺仪
零偏
标度因数
温度补偿
silicon micro gyroscope
zero bias
scale factor
temperature compensation
FPGA