CEM-3覆铜板发展前景及对电子玻纤纸的要求

Developing Prospects of CEM- 3 CCL and Requirements for Electronic Fiberglass Paper

介绍了CEM-3覆铜板的组成结构与特点,分析了CEM-3覆铜板的市场发展前景与技术发展前景及目前玻纤湿法毡的产能情况,重点阐述CEM-3覆铜板对电子玻纤纸的内在质量、表观质量、均匀性、抗拉强度与湿强度等要求。就电子玻纤纸当前的技术标准与技术发展动态给电子玻纤纸行业提出了改进的建议。

The structure and features of CEM - 3 CCL are described, and the prospects of market growth and tech- nology development of CEM - 3 CCL as well as the current production capacity of wet-laid fiberglass mats are analyzed ,with stress on the properties of fiberglass paper such as inherent and apparent quality, homogeneity, tensile strength and wet strength required by CEM -3 CCL. Some suggestions for improving electronic fiberglass paper industry are put forward in terms of its current technical standards and technology developments.