摘要
采用HSCAE软件对电器外壳的注射成型过程进行了模拟,分析了塑件翘曲变形的原因并提出了改进措施,对塑件成型工艺进行了优化,提高了塑件成型质量和生产效率,为类似塑件的注射模设计提供了理论依据。
The injection moulding process for an electrical apparatus shell was simulated by using the HSCAE software. The cause of the shell warpage was analyzed and the improvement measures were proposed. Then the moulding process was optimized.
出处
《模具工业》
2014年第8期46-49,共4页
Die & Mould Industry
关键词
注射模
翘曲
模流分析
工艺参数
HSCAE
injection mould
warpage
mould flow analysis
process parameters
HSCAE
