摘要
采用真空热压法制备不同MoS2含量的Cu/Cu-MoS2功能复合材料,测定其密度、硬度和电导率,并用MMU-5GA微机控制真空高温摩擦磨损试验机测试其摩擦磨损性能,通过扫描电镜对试样显微组织及磨损形貌进行观察,并进行能谱分析。结果表明:通过真空热压法制备的功能复合材料组织均匀、过渡层明显,Cu层与耐磨层的过渡平稳,界面结合强度较高;烧结过程中,Cu与部分MoS2发生反应,烧结产物主要为复杂的CuS-Mo化合物及单质Mo;随着MoS2含量的增加,材料的电导率和密度下降,硬度及耐磨性提高;单质Mo及MoS2对材料的耐磨性影响较大,当耐磨层含3%质量分数的MoS2时,功能复合材料的电导率与耐磨性有较好的配合。
The Cu/Cu-MoS2 composite material was prepared by vacuum hot pressing. The density, hardness and conductivity of the composite were measured. Wear Resistance of the composite was tested by high-temperature friction and wear sampler which was used in vacuum and controlled by MMU-5GA microcomputer. Microstructure and grinding crack morphology of the composite were analyzed by scanning electron microscope. The results show that the composite has uniform microstructure and obvious transition layer. There is a smooth transition layer be- tween the copper layer and the wear-resistant layer, and the composite has high interface bonding strength. Cu re- acts with part of MoS2 during the process of sintering, the sintered products mainly are complex compounds of Cu, Mo and S, and elementary Mo. With the increase of MoS2content, the conductivity and density of the composite decrease, and the hardness and wear resistance increase. Elementary Mo and MoS2 have great effects on the wear resistance of the composite. Both the conductivity and wear-resistance of the composite are superior when the content of MoS2 is 3 wt%.
出处
《粉末冶金工业》
CAS
北大核心
2014年第4期35-39,共5页
Powder Metallurgy Industry
基金
河南省重大科技专项(102105000007)
关键词
真空热压
功能复合材料
微观组织
耐磨性
vacuum hot pressing
functional composite material
microstructure
wear resistance