期刊文献+

LED贴片机技术应用与新进展 被引量:1

A Overview of LED Placement Equipment
下载PDF
导出
摘要 能源紧缺是这一时代面临的挑战之一,时下的雾霾多发更多地让人们增加对绿色能源的关注。环保节能型产品更受到政府和人们的青睐。LED照明产品以其无可比拟的优势有望在10年内代替人类使用近一百年的传统光源,毫无疑问,LED照明产品正在迅猛发展。随着LED照明市场的快速发展,涉及到LED贴片机的迅速发展,各种性能的LED专用贴片机都被研制。 Abstract :Energy shortage is one of the challenges in this era, and the frequent occurrence of fog haze weather let people pay more attention to environmentally friendly energy. Environmental protection and energy saving products are more wining the favour of the government and the people. LED lighting products, with its incomparable advantage, are expected to replace the traditional light source ,which have been used by human nearly one hundred years,within the next 10 years. There is no doubt that LED lighting products are growing rapidly. The rapidly development of LED market leading to a rapidly development of the LED placement equipment, and a various of LED placement equipment having different performance has been developed.
出处 《江西科学》 2014年第4期450-454,458,共6页 Jiangxi Science
基金 广东省科技型中小企业技术创新专项基金项目(编号:2012CY142)
关键词 能源紧缺 表面贴装技术(SMT) LED照明 LED贴片机 energy shortage surface mounting technology, LED lighting products, LED placement equipment
  • 相关文献

参考文献16

  • 1贾忠中.SMT核心工艺解析与案列分析(第二版)[M].北京:电子工业出版社,2013:3.
  • 2江力,徐明利.表面组装技术[M].合肥:中国科学技术大学出版社,2013:2-14.
  • 3王天曦,王豫明.贴片机及其应用[M].北京:电子工业出版社,2011.
  • 4方孔婴.电子工艺技术[M].北京:科学出版社,2009.
  • 5鲜飞.贴片机呈现五大趋势选择设备应全面评估[N].中国电子报,2008-04-29.
  • 6Rick Flayler. Placement Accuracy Management [ J ]. SMT,2005.
  • 7中国SMD资讯网-SMD工程师互动社区[EB/OL].http://www.smd.net.c.
  • 8鲜飞.表面组装技术的发展趋势[J].电子工业专用设备,2009,38(1):8-14. 被引量:6
  • 9张文典.21世纪SMT发展趋势及对策[J].电子工艺技术,2001,22(1):1-4. 被引量:6
  • 10张文典.实用表面贴装技术(第3版)[M].北京:电子工业出版社,2010.

二级参考文献15

  • 1鲜飞.选择性焊接工艺技术的研究[J].印制电路信息,2006,14(6):60-63. 被引量:11
  • 2[1]0603 Mounting process & equipment[EB].kyushu matsushita electric co.ltd.FA division.
  • 3[2]0603-Format chip parts move into mass-production spotlight as need s intensify for miniature parts.
  • 4[3]Wang qing Flip Chip in package[EB]. kester co.ltd.
  • 5张文典.21世纪SMT发展趋势及我们的对策[C]..首届全国电子元器件应用技术研讨会[C].,2001.58-63.
  • 6BURKE E K,COWLING P I,RALF K.New models and heuristics for component placement in printed circuit board assembly [A].Proceedings of the 1999 IEEE International Conference on Information,Intelligence and Systems (ICIIS99)[C].IEEE,1999.133-140.
  • 7LEIP(A)L(A)T,NEVALAINEN O.Optimization of the movements of a component placement machine[J].European Journal of Operation Research,1989,38 (2) :167-177.
  • 8LEU M C,WONG H,JI Z.Planning of component placement/insertion sequence and feeder setup in PCB assembly using genetic algorithms[J].Journal of Electronic Packaging,Transactions of the ASME,1993,115 (4):424-432.
  • 9KHOO L P,NG T K.A genetic algorithm-based planning system for PCB component placement[J].International Journal of Production Economics,1998,54 (3):321-332.
  • 10Teck Sang Loh,Satich T.S.Bukkapatnam,D MEDEURIS,Hongkyu Kwon.A genetic algorithm for sequential.part assignment for PCB assembly[J].Computer&Industrial Engineering,2001,40 (4):293-307.

共引文献61

同被引文献4

引证文献1

二级引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部