摘要
聚合物低温键合技术是MEMS器件圆片级封装的一项关键技术。以苯并环丁烯(BCB)、聚对二甲苯(Parylene)、聚酰亚胺(Polyimide)、有机玻璃(PMMA)作为键合介质,对键合的温度、压力、气氛、强度等工艺参数进行了研究,并分析了其优缺点。通过改变Parylene的旋涂、键合温度、键合压力、键合时间等工艺参数进行了优化实验。结果表明,在230℃的低温键合条件下封装后的MEMS器件具有良好的键合强度(>3.600 MPa),可满足MEMS器件圆片级封装要求。
Low-temperature bonding using polymer medium is a key technique of the wafer-level adhesive bonding in MEMS devices. With BCB,Parylene,Polyimide,PMMA as the bonding medium,the bonding temperature,bonding force,atmosphere and bond strength are studied,and their advantages and disadvantages are analyzed. Parylene bonding parameters are optimized by changing spin coating,bonding temperature,bonding force,bonding times and etc. The results show that low temperature bonding encapsulation of MEMS devices has good bonding strength（ 3. 600 MPa） at 230 ℃,meeting the requirements of the wafer-level adhesive bonding in MEMS devices.
出处
《电子科技》
2014年第9期175-177,共3页
Electronic Science and Technology
关键词
低温键合
聚合物
键合强度
圆片级封装
low-temperature bonding
polymer
bonding strength
wafer-level packaging
