LED封装领域专利技术分析及预警研究

Study of Patent Technology Analysis and Early Warning in the LED Packaging Field

通过分析LED封装领域专利技术现状、研究热点、重点技术及我国LED封装领域专利技术存在的问题,归纳了对中国LED封装领域形成专利壁垒的核心技术专利,并对封装领域核心技术进行深度分析及预警。

This paper sums up the core patents that form the patent barriers to the China ＇s LED packaging field.It carries out the deep analysis and early warning through the analysis of present situation of patent technology , key technologies , and the existing problems in the LED packaging field in our country .