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新型冷板对服务器CPU散热的研究及能耗分析 被引量:2

Analysis of Heat Dissipation Effect and Energy Consumption on a New Type of Cooling Device Used in Server CPU
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摘要 设计了一种新型服务器散热的冷却装置,以一台服务器CPU及机箱为研究对象,建立热分析数学模型.通过比较空气冷却与液体蒸发冷却的模拟散热效果,分析施行强制对流协同冷板蒸发冷却方案的可行性.实验验证了模拟的可行性,结果表明:强制对流蒸发冷却对服务器CPU及机箱散热效果明显,120 W高功耗下CPU的工作温度仍较为稳定,且机箱内的温度分布更为均匀.该方式不仅有利于单台服务器机箱的散热,并且在小型服务器工作站能耗分析中,相对风冷散热其空调机房能耗要减少40%左右. A new type of cooling device used in server was designed.Taking a server CPU as a research object,a mathematical model for thermal analysis was established and the temperature and velocity fields distributions were simulated.The simulated heat dissipation effects of air cooling and liquid cooling were compared to analyze the feasibility of the plan of forced convection liquid cooling.The effectiveness of simulation was proved by experiments.The results show that as the CPU is cooled by forced convection liquid cooling,the temperature distribution is more uniform and the temperature of the CPU is more stable in the condition of high power consumption(120 W).The device proposed can be applied in the cooling of a single server chassis,and can be extended further in the cooling of a small server workstation.The energy consumption analysis of the small server workstation shows that,comparing with the air-cooled heat emission,the energy consumption of air-conditioned computer room can be reduced by about 40%.
出处 《上海理工大学学报》 CAS 北大核心 2014年第4期317-321,共5页 Journal of University of Shanghai For Science and Technology
关键词 新型冷板 CPU散热 蒸发冷却 模拟 能耗分析 new type of cold plate CPU heat dissipation evaporative cooling simulation energy consumption analysis
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  • 1陈洁茹,朱敏波,齐颖.Icepak在电子设备热设计中的应用[J].电子机械工程,2005,21(1):14-16. 被引量:75
  • 2李琴,朱敏波,刘海东,张现亮.电子设备热分析技术及软件应用[J].计算机辅助工程,2005,14(2):50-52. 被引量:32
  • 3梁斌,方伟,田静,曹红,何菊.电子设备结构优化设计支撑软件技术[J].电讯技术,2007,47(2):189-193. 被引量:6
  • 4朱敏波,赵惇殳,康洪林.电子设备机箱强迫风冷热测试实验分析[J].无线电通信技术,1997,23(1):52-55. 被引量:2
  • 5.Flotherm introduction[EB/CD].上海:Flomerics Inc中国代表处,2001..
  • 6.Advanced Thermal Modeling[EB/CD].北京:海基科技发展有限责任公司,2001..
  • 7COLGAN E G,FURMANB,GAYNES M,etal.High performance and subambient silicon microchannel cooling[J].Journal of Heat Transfer,2007,129 (8):1 047 -1 051.
  • 8ZHANG H Y,PINJALA D,WONG T N,et al.Development of liquid cooling techniques for flip chip ball grid array packages with high heat flux dissipations[J].IEEE Trans Components and Packaging Technology,2005,28(1):127-135.
  • 9EGAN V,STAFFORD J,WALSH P,et al.An experimental study on the design of miniature heat sinks for forced convection air cooling[J].Journal of Heat Transfer,2009,131(7):071402.
  • 10CENGEL Y A.Heat Transfer:A Practical Approach[M].2nd ed.New York:McGraw-Hill,2003.

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