摘要
本文主要描述了在电子焊接工艺技术从有铅转移到无铅的过程中,需要关注的内容。根据无铅焊接的固有特性,探讨了应该如何从焊接材料、设备、元器件、工艺技术、PCB设计上进行调整,从而满足无铅化生产质量的要求。
This paper mainly describes the content needed to pay attention to during the process of from having lead to lead-free in the electronic welding technology. According to the intrinsic characteristics of lead-free soldering, based on the problems that how to adjust from changing welding materials, equipment, components, process technol-ogy and PCB design, so as to meet the requirements of lead-free production quality.
出处
《日用电器》
2014年第8期55-57,共3页
ELECTRICAL APPLIANCES
关键词
无铅焊接
焊接材料
设备
元器件
lead-free soldering
welding materials
equipment
components