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前处理对高体积分数SiC_p/Al复合材料化学镀镍的影响 被引量:4

Influence of pretreatment on electroless nickel plating on high volume fraction SiC_p/Al composite
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摘要 对高体积分数SiCp/Al复合材料进行前处理,再化学镀镍。研究了除油、粗化、活化对SiCp/Al复合材料化学镀镍的影响。分析了镀镍层的显微组织。结果表明,有机溶剂除油比碱液除油效果好。H2O2系粗化比HF系粗化更为适宜。在由醋酸镍、次亚磷酸钠和乙醇组成的活化剂中室温浸润,然后160℃温度下热还原30min,化学镀镍镀速较高。前处理后在SiCp/Al复合材料表面化学镀镍可沉积上致密、均匀、结合良好的镀镍层。 The high volume fraction SiCp/Al composite was processed by pretreatment,then it was proceeded by electroless nickel plating.The influence of deoiling,roughening,activating on electroless nickel plating on SiCp/Al composite was investigated.The microstructure of electroless nickel plating on composite was ana-lyzed.The results show that organic solvent was better than alkaline solvent for deoiling.H2 O2 system was more appropriate than HF system for roughening.Infiltrating in activation solution consisted nickel acetate,so-dium hypophosphite and alcohol at room temperature,then thermo deoxidizing at 160 ℃ temperature for 30 min,the procedure makes electroless nickel plating rate higher.After pretreatment,electroless nickel plating deposited on SiCp/Al composite surface was dense,uniform,firmly combined.
出处 《功能材料》 EI CAS CSCD 北大核心 2014年第18期18117-18119,共3页 Journal of Functional Materials
基金 江西省自然科学基金资助项目(20132BAB206010) 江西省教育厅科学枝术基金资助项目(GJJ11522)
关键词 SICP AL复合材料 前处理 化学镀镍 SiCp/Al composite pretreatment electroless nickel plating
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参考文献12

  • 1MolinaJM,NarcisoJ,WeberL,etal.ThermalconductivityofAl-SiCcompositeswithmonomodalandbimodalparticlesizedistribution[J].MaterialsScienceandEngineering,2008,480(2):483-488.
  • 2MolinaJM,RhemeM,CarronJ,etal.Thermalconductivityofaluminum matrixcompositesreinforced withmixturesofdiamondandSiCparticles[J].ScriptaMaterial,2008,58(5):393-396.
  • 3ZhangJianyun,SunLiangxin,WangLei,etal.PreparationofSiCparticulatereinforced356Almatrixcompositeforelectronicpackaginganditsthermalexpansionperformance[J].JournalofFunctionalMaterials,2004,35(4):507-508.
  • 4Cui Yan,Wang Lifeng,Ren Jianyue.Multi-functional SiC/Al Composites for Aerospace Applications[J].Chinese Journal of Aeronautics,2008,21(6):578-584. 被引量:71
  • 5樊建中,肖伯律,徐骏,石力开.SiCp/Al复合材料在航空航天领域的应用与发展[J].材料导报,2007,21(10):98-101. 被引量:34
  • 6TianDalei,WangXing,GuanRongfeng.PresentstatusandprospectsoftheresearchesontheSiCp/Alcompositematerialsforelectronicpackaging[J].ElectronicsandPackaging,2007,7(3):11-15.
  • 7李敬勇,赵勇.颗粒增强铝基复合材料的焊接性及其搅拌摩擦焊[J].材料开发与应用,2004,19(6):30-33. 被引量:6
  • 8WangShaogang,LiuHongxia.BrazabilityofSiCparticulatereinforcedaluminummatrixcomposites[J].JournalofMaterialsScienceandEngineering,2009,27(2):186-189.
  • 9IuditP,ViktorM,ZoltanG.ArrangementoftheAl-NiphasesinAl/SiC(Ni)pcomposites[J].InternationalJournalofMicrostructureand MaterialsProperties,2012,7(1):49-63.
  • 10TranT N,YuG,HuBN,etal.Effectsofpretreatmentsofmagnesiumalloysondirectelectrolessnickelplating[J].TransactionsoftheInstituteofMetalFinishing,2012,90(4):209-214.

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