摘要
研究了一种适用于模压的苯并噁嗪(BOZ)树脂,并采用凝胶渗透色谱(GPC)法、红外光谱(FT-IR)法、差示扫描量热(DSC)法和热失重分析(TGA)法等对其结构和热性能进行了分析。研究结果表明:BOZ树脂具有适宜的黏度和凝胶时间,可满足模压工艺的要求;采用Kissinger和Crane方程计算得到BOZ树脂体系固化反应的活化能为188.62 kJ/mol、反应级数为0.96;BOZ树脂体系的耐热性较好,其900℃时的残炭率为66.90%。
A suitable benzoxazine （BOZ） resin for molding was investigated, and its structure and thermal properties were analyzed by gel permeation chromatography （GPC） , infrared spectroscopy （FT-IR） , differential scanning calorimetry （DSC） and thermogravimetric analysis （TGA）. The research results showed that the BOZ resin could meet the requirements of molding process because it had suitable viscosity and gel time. The activation energy （188.62 kJ/mol） and reaction order （0.96） of curing reaction of BOZ resin system were calculated by Kissinger and Crane equations. The BOZ resin system had the better thermostability because its carbon residue rate at 900 ℃ was 66.90%.
出处
《中国胶粘剂》
CAS
北大核心
2014年第8期13-15,34,共4页
China Adhesives
基金
国防基础科研项目(C0320110006)
关键词
苯并噁嗪
酚醛树脂
模压
动力学
benzoxazine （BOZ）
phenolic resin （PF）
molding
kinetics
