摘要
研究了时效对电场和超声振动共同作用下Sn2.5Ag0.7Cu0.1RE/Cu钎焊接头组织与性能的影响。结果表明:Sn2.5Ag0.7Cu0.1RE/Cu钎焊接头界面生成的IMC主要由靠近钎料合金一侧的Cu6Sn5相,而时效后界面靠近Cu一侧出现Cu3Sn。时效过程中,随着时效时间和时效温度的增加,Sn2.5Ag0.7Cu0.1RE/Cu界面区生长受扩散机制控制,IMC总厚度增加,力学性能下降。
The effects of aging on the microstructure and properties of Sn2.5Ag0.7Cu0.1RE/Cu soldering joints under theaction of the electric field and ultrasonic vibration were studied. The results show that IMC of brazing interface is mainlyCurSn5 phase closing to the solder alloy, while Cu3Sn appears near Cu interface after aging. With the aging time and agingtemperature increasing, the growth of Sn2.5Ag0.7Cu0.1RE solder alloy joints interface region is controlled by diffusionmechanism, and the total thickness of the IMC increases, the properties of the solder joint decreases.
出处
《热加工工艺》
CSCD
北大核心
2014年第17期44-46,50,共4页
Hot Working Technology
基金
河南省教育厅科学技术研究重点项目(13A430326)
郑州机械研究所新型钎焊材料与技术国家重点实验室开放课题(SKLABFMT201002)
河南省高等学校矿业工程材料重点学科开放实验室开放课题(MEM12-2)
河南理工大学青年基金资助项目(Q2012-25A)
