摘要
SM T在电子装配业不断发展,地位日渐重要。文中从装配准备、贴片、焊膏丝印和回流焊接等角度探讨了SM T的质量控制问题,提出了相应的质量控制措施。
SMT is ceaselessly developed and becomes important. This paper analyzes SMT quality control from preparation ,patch, solder paste printing anti reflow soldering, puts t'orward corresponding quality control measures.
出处
《机械工程师》
2014年第9期62-63,共2页
Mechanical Engineer