薄板陶瓷微孔的激光加工工艺研究

Technologic Investigation of Laser Micro-Drilling on the Thin Ceramic Plate

主要研究薄板陶瓷微孔的激光精密加工工艺。具体采用CO2、光纤激光器以脉冲打孔和切割技术，通过优化激光器功率、占空比、重复频率、离焦量、辅助气体类型、气压等工艺参数，旨在改善激光加工陶瓷微孔的热影响、锥度和提高激光加工效率满足工业应用的要求。实验结果表明：采用CO2激光能够加工出孔径为80～200μm的微孔，其效率达18hole／s，热影响也得到了明显改善；而采用光纤激光单脉冲方式打孔速度达300hole／s，其微孔锥度可控；切割方式打孔速度达6～8hole／s，且能够获得孔径为100μm的直微孔的稳定激光微加工。

The laser precision micromachining processes on the thin ceramic plate are investigated. By taking pulse laser drilling as well as laser cutting technology, this work aims at improving the heat affected zone of laser processing as well as the conicity of microhole and increasing laser processing efficiency to satisfy the industrial requirement. The laser process parameters including laser output power, duty cycle, repeated frequency, the offset of focus spot, the type of assistant gas and gas pressure are optimized in the experiments. The results show that the microholes with diameter of 80~ 200 μm are obtained by using CO2 laser drilling on ceramic plate and its efficiency up to 18 hole/s; the heat affected zone has also been significantly improved. The conicity controllable microholes are achieved by single pulse drilling technology with fiber laser and its efficiency achieves 300 hole/s. The stable laser precision micromachining on the ceramics for the straight microholes with diameter of 100 μm is also obtained by laser cutting technology using fiber laser and its efficiency achieves 6~8 hole/s.