摘要
本文介绍了干法清洗中发展较快、优势明显的等离子体清洗的机理、类型、工艺特点等。并根据在低气压下由直流辉光放电产生等离子体的方法,研制了一种适用于PCB微切片清洗的等离子体清洗机,同时对该等离子体清洗机的真空系统、高压电源、控制过程的设计作出了详细的说明。
This article introduces the principle, type and technological characteristics of plasma cleaning which experiences quick development and has obvious advantage in dry cleaning. A plasma cleaning machine suitable for PCB microsection cleaning had developed with the method which can produce plasma by DC glow discharge under low atrophic pressure. Detailed description was provided for the design of the vacuum system, high voltage power supply and control process of the plasma cleaning machine.
出处
《真空》
CAS
2014年第5期25-31,共7页
Vacuum