LED封装用含氢硅油交联剂的制备及应用

Preparation and application of polymethylhydrosiloxanes crosslinking agent for LED encapsulation

通过阳离子开环聚合制备了不同规格的含氢硅油,借助FT-IR、1 H-NMR和GPC对产物的结构和分子量分布进行了表征。确定了制备含氢硅油的最优工艺条件为：聚合温度65℃,聚合时间4h。将合成的含氢硅油交联剂与乙烯基MQ硅树脂进行混合,在氯铂酸催化下固化得到封装材料,对其进行性能测试。结果表明：含氢硅油的最佳应用条件为：含氢量0.75%,粘度118～224mPa·s,nSi-H/nSi-Vi=1.3～1.5。按此条件制成的封装材料邵氏A硬度为62～66度、拉伸强度达4.94～5.45MPa、断裂伸长率231%、透光率高于90%。

A series of hydrogenous silicone oil was prepared by cationic ring-opening polymerization. The chemical structure and MWD were characterized by FT-IR, ^1H-NMR and GPC. The optimum condition to synthesize hydrogenous silicone oil were including under 65℃ and lasting 4 hours. The mixture of hydrogenous silicone oil and vinyl substituted MQ silicone resin was cured to prepare packaging material. The material performed well when the hydrogen content was 0. 75 % （mass）,the viscosity was 118～224 mPa·s and the molar ratio was nsi-H/nsi-vl = 1.3～1.5. A transparent packaging material with shore a hardness of 62～66 degree, tensile strength of 4. 94～5.45MPa, breaking elongation rate of 231% was obtained by using the process conditions above.